As each new generation of electronic equipment exhibits higher performance into ever smaller packages, the need for dissipating power in the form of heat grows ever more demanding and requires some degree of thermal management.

AMEC Thermasol markets a comprehensive range of Thermal Management Materials, our products include thermally conductive pads / insulators and gap fillers, thermally conductive adhesive tapes, phase change interface materials and graphite foil.

     
Ceramic Heatsinks

Ceramic Heatsinks

The structure of the Micro Porous Ceramic Heat Sink provides a very large surface area compared to conventional Copper and Aluminium Heat Sinks. Even though the thermal resistance of the Ceramic is much higher than Aluminium because of the micro porous structure it provides excellent heat dissipation and heat convection. It also provides low thermal capacity in unit volume compared to Copper and Aluminium Heat Sinks. The MPCHS dissipates heat faster than metal Heat Sinks without storing heat within itself.

 

 
Heatsinks

Pressfin heatsinks

Pressfin heat sinks are 30-40% more efficient when compared to extruded or die cast heat sinks, thus ensuring a low thermal difference between the heat sink & the device. Round pins offer a greater surface area when compared to square pins. Pressfin heat sinks react much faster as the manufacturing process ensures the atomic structure of the aluminium is in the direction of the heat flow. They are particularly suitable for applications generating high levels of heat and where space & weight are at a premium.

 

 
Thermal Interface Materials

Thermal Interface Materials

A wide variety of materials include High Thermally Conductive artificial graphite sheet (up to 1900W/mk), Silicone Filler Pads (up to 6W/mk), Thermal Paste (up to 6.5 W/mk), Phase Change Filler Pads (up to 5.0 W/mk), Thermal Adhesive Transfer Tapes (up to 1.40W/mk).

 

 
Flat Cool Pipes

Flat Cool Pipes

As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management.Thermasol markets a variety of Thermal Management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc.

 


For your EMC/EMI and Anti-Vibration requirements please see our other divisions:



   

   Registered Company Number: 383242 - VAT Number: GB740 7652 32
   AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2014 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   AMEC Thermasol, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

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