Paste

  

  • DP series are very soft paste-type gel with excellent thermal conductivity
    up to 6.5W/m · K.


  • Cross-linked particles of the eliminate running and vaporization seen with grease and phase change materials.

  • Electrically insulative, DP series are ideal for electronic devices.

  • DP series with low thermal dependency, has a wide operating temperature range from -20 up to 200°C (-4 up to 392°F) for a long time.

  • DP series have very high dielectric properties up to 1.4 x 1014 ohm · cm.

  • DP series have a very low dissipation factor down to 0.0004 @ 1 Mhz.

  • Three (3) types of DP series are available according to conductivity and hardness.

Specification:

Item
Paste-type Thermal Gel DP Series
Remark
DP-100
DP-200
DP-300
Thermal Conductivity
Our tests
6.5
4.8
4.8
Std.
Hot Wire Method *
2.1
1.6
1.6
JIS R 2618
Appearance
Gray paste
Gray paste
White Paste
-
Specific gravity
2.8
2.6
2.7
JIS K 6249
Hardness (Cone penetration ·
1/10mm not mixed)
45
55
60
JIS K 6249
(1/4 cone)
Specific volume resistance ratio
(Ohm · cm)
5.9 × 10
7.2 × 10
1.4 × 10
JIS C 2101
Dielectric constant
<50Hz>
8.9
7.6
4.4
JIS C 2101
<1kHz>
7.8
6.7
4.2
JIS C 2101
<1MHz>
7.0
6.6
4.0
JIS C 2101
Dielectric dissipation
factor
<50Hz>
0.234
0.017
0.005
JIS C 2101
<1kHz>
0.061
0.007
0.004
JIS C 2101
<1MHz>
0.015
0.005
0.0004
JIS C 2101
Dielectric breakdown voltage
(kV/mm)
5.0
5.6
9.6
JIS C 2101
Low molecular weight siloxane
level D4 to D10 (ppm)
Not more than 700
Not more than 900
Not more than 300
Solvent extraction method
Temperature range
(°C)
-40 to 200
-40 to 150
-40 to -120
-
TECHNICAL DATA
Thickness (mm)
0.15
0.20
0.30
Thermal Resistance (°C/W)
0.13
0.15
0.18
Thickness (mm)
0.10
0.20
0.30
Thermal Resistance (°C/W)
0.13
0.17
0.22
Thickness (mm)
0.15
0.20
0.30
Thermal Resistance (°C/W)
0.09
0.17
0.25
     
THE FLOW OF HEAT
   
 
SUGGESTED USES

  • Gaps around heat sources such as high performance semiconductors.
  • The surface, underside and lead lines of heat sources such as IC's.
  • Sources of heat where it is difficult to fix sheet-type thermal gel.
  • Where there is insufficient room for thermal conductive material.