Paste

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Specification:
Item |
Paste-type
Thermal Gel DP Series |
Remark |
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DP-100 |
DP-200 |
DP-300 |
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Thermal
Conductivity |
Our
tests |
6.5 |
4.8 |
4.8 |
Std. |
Hot
Wire Method * |
2.1 |
1.6 |
1.6 |
JIS
R 2618 |
|
Appearance |
Gray
paste |
Gray
paste |
White
Paste |
- |
|
|
Specific
gravity |
2.8 |
2.6 |
2.7 |
JIS
K 6249 |
|
|
Hardness
(Cone penetration · 1/10mm not mixed) |
45 |
55 |
60 |
JIS
K 6249 (1/4 cone) |
|
|
Specific
volume resistance ratio (Ohm · cm) |
5.9
× 10 |
7.2
× 10 |
1.4
× 10 |
JIS
C 2101 |
|
Dielectric
constant |
<50Hz> |
8.9 |
7.6 |
4.4 |
JIS
C 2101 |
<1kHz> |
7.8 |
6.7 |
4.2 |
JIS
C 2101 |
|
<1MHz> |
7.0 |
6.6 |
4.0 |
JIS
C 2101 |
|
|
Dielectric
dissipation factor |
<50Hz> |
0.234 |
0.017 |
0.005 |
JIS
C 2101 |
<1kHz> |
0.061 |
0.007 |
0.004 |
JIS
C 2101 |
|
<1MHz> |
0.015 |
0.005 |
0.0004 |
JIS
C 2101 |
|
Dielectric
breakdown voltage (kV/mm) |
5.0 |
5.6 |
9.6 |
JIS
C 2101 |
|
|
Low
molecular weight siloxane level D4 to D10 (ppm) |
Not
more than 700 |
Not
more than 900 |
Not
more than 300 |
Solvent
extraction method |
|
Temperature
range (°C) |
-40
to 200 |
-40
to 150 |
-40
to -120 |
- |
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TECHNICAL DATA |
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THE FLOW OF HEAT |
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SUGGESTED USES
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