Thermal Paste
As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller packages, it will dissipate power in the form of heat and requires some degree of thermal management.
Thermosol markets a variety of Thermal Management Materials in response to the changing needs of the assembly of electronics packaging in notebook computers, hi-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. Our products include thermally conductive Pads / Insulators and gap fillers, thermally conductive adhesive tapes, phase change interface materials, graphite foil.
THERMAL PASTES |
|||||||
Series
|
Thermal Cond.
W/m-K |
Specific Heat
kJ/kg-K |
Specific Gravitiy (g/cc)
|
Specific volume resistance ratio
(Ohm · cm) |
Temp Range oC
|
Colour
|
Data
|
DP-100 |
6.50 |
- |
2.8 |
5.9x10 |
-40 ~ 200 |
Grey |
 |
DP-200 |
4.80 |
- |
2.6 |
7.2x10 |
-40 ~ 150 |
Grey |
|
DP-300 |
4.80 |
- |
2.7 |
1.4x10 |
-40 ~ 120 |
White |
|
MGS-A300 |
4.00 |
0.8 |
2.6 |
2.0x10 |
0 ~ 150 |
Grey |
|
MGS-C200 |
1.70 |
0.9 |
2.8 |
2.1x10 |
0 ~ 150 |
Brown |
|
KTP-12 |
10.0 |
- |
- |
- |
-60 ~ 150 |
Silver |
|
KTP-92 |
10.0 |
- |
- |
- |
-60 ~ 200 |
Silver |
|
MSC-310 |
3.2 |
- |
2.5 |
3 x 10 |
-45 ~ 150 |
Grey |
|
