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Micro Porous Ceramic Heat Sink / FCH Ceramic Series

IC components for compact and slim electronic products are usually limited by the available space and height. The slim nature of ceramic heat sink can provide a suitable cooling solution.

The entirely new material structure of a ceramic heat sink moves heat by air circulation (without external force) through the embedded radiation micro porous ceramic material such that, the accompanying IC components, can operate continuously in a given temperature environment.

A ceramic heat sink is non-electrical conductive, humidity and dust proof by its special material nature. With a long life span and simple assembly process (can be attached by applying thermal paste or thermal adhesive tape to the surface of any IC component). A ceramic heat sink saves not only assembly time but also material and labor costs.

Ceramic heat sinks are now adopted by IC of power under 10W while specially designed ones are also available for high-watt ICs. They are both ROHS and REACH compliant green material.

Dimensional Data:

Part Number Length (mm) Width (mm) Height (mm) Shape Datasheet
FCH252505T 25 25 5.0 Fin Download
FCH30305T 30 30 5.25 Fin Download
FCH303512T 35 30 12.25 Fin Download
FCH40405T 40 40 5.25 Fin Download
FCH505010T 50 50 10.25 Fin Download
FCH505015T 50 50 15.25 Fin Download


All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.



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