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Thermal Filler Pads / W Series Pads

As each new generation of electronics equipment exhibits higher performance and more and more power into ever smaller package sizes, it will dissipate power in the form of heat and requires some degree of thermal management.Thermasol markets a variety of Thermal Management materials in response to the changing needs of the assembly of electronics packaging in notebook computers, high-performance CPU, chipsets, mobile electronic appliances, power conversion and amplification modules etc. Our products range include thermally conductive Pads / Insulators and gap fillers, thermally conductive adhesive tapes, phase change interface materials, graphite sheet.

Our Thermal Filler pads have a thermal conductivity that ranges from 1.0~6.0W/m.k, with hardness from 12 Shore 00 ~ 85 Shore A. Some materials are availabe with adhesive tape and glassfiber re-enforcement. We also have Silicone Free materials. Custom die cut shapes can be supplied.

Part Number Thermal Cond.
Hardness Temperature
Range (C)
Thickness (mm) Available
with PSA
Fibreglass Colour Notes Datasheet
W10TR600A 6.00 80 Shore 00 -40 ~ 200 0.3 ~ 5.0 Yes - >10 Download
W6TR315G 3.15 20 Shore 00 -40 ~ 200 0.8 ~ 8.0 No 1 Side 1 Download
W8TR170D 1.70 70 Shore 00 -40 ~ 200 0.3 ~ 18 Yes - >2 Download
W8TR500G 5.00 65 Shore 00 -40 ~ 200 0.3 ~ 18 Yes Yes >2 Download

Shore Hardness Scale


All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.



   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   AMEC Thermasol, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

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