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Thermal Non-Silicone Filler Pads / WG Non-Silicone Series Pads

WG Series non silicone thermal pad, use of soft acrylic as base materials, fill with heat conductive ceramic powder. Has good heat conduction, good for apply on heat sink and insulation. Does not contain silicone molecular which will contaminate lens or contact point for electronic device.

Part Number Thickness
Material Type Thermal Conductivity
Thermal Resistance
((C)-cm2/W 31mm sq @150psi)
Temperature (C)
Range (C)
Max Sheet
Size (mm)
Colour Datasheet
WG-15NS 0.3 ~ 10.0 Yes 1.5 - -40 ~ +120 >6 Download
WG-35NS 0.5 ~ 10.0 Yes 3.0 - -40 ~ +120 >6 Download

Shore Hardness Scale


All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.



   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   AMEC Thermasol, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

Cert: 4823
ISO 9001