Navigation Tree: Home / Thermal Management / Thermal Materials / Filler Pads & Films / WG Non-Silicone Series Pads

     

Thermal Non-Silicone Filler Pads / WG Non-Silicone Series Pads

WG Series non silicone thermal pad, use of soft acrylic as base materials, fill with heat conductive ceramic powder. Has good heat conduction, good for apply on heat sink and insulation. Does not contain silicone molecular which will contaminate lens or contact point for electronic device.



Part Number Thickness
(mm)
Material Type Thermal Conductivity
(W/m.k)
Thermal Resistance
((C)-cm2/W 31mm sq @150psi)
Transition
Temperature (C)
Temperature
Range (C)
Max Sheet
Size (mm)
Colour Datasheet
WG-15NS 0.3 ~ 10.0 Yes 1.5 - -40 ~ +120 >6 Download
WG-35NS 0.5 ~ 10.0 Yes 3.0 - -40 ~ +120 >6 Download

Shore Hardness Scale



ANNOTATION

All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.

 

   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
   View sitemap.

   Address:   AMEC Thermasol, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

ISOQAR
Cert: 4823
ISO 9001