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Thermal Conductive Tape / TH Series

The TH Series of thermally conductive adhesive tapes possess extremely high 2.5W/mk Thermal Conductivity and low thermal impedance and yet maintain a high bonding strength.

The tape can be used to replace thermal filler pads, thermal grease with mechanical fixings. Applications include bonding Heat Sinks, Microprocessors, LED's, and other high power semiconductors.

Feature:
- Thermal Conductivity 2.5 W/m-k
- High bond strength to a variety of surfaces.
- Double sided pressure sensitive adhesive tape.
- High performance thermally conductive acrylic adhesive.

Application:
- Mounting heatsinks on BGA processor or drive processor.
- Mounting heat spreader onto PCB or onto motor control PCB.
- Can be used instead of heat cure adhesive, screw mounting or clip mounting.


Part Number Adhesive Type Continuous Use Temp Thickness Thickness Tolerance Voltage Breakdown Steel Adhesion
(g/25mm)
Thermal Impedance
@50psi
Datasheet
TH-10NF Acrylic Adhesive -40C ~ 120C 0.1mm 0.02mm >3000 Vac 800 0.31Cin2/W Download
Part Number Thermal Conductivity Volume Resistivity Hardness Holding Power
(25�C / Hours)
Holding Power
(80�C / Hours)
TH-10NF 2.5W/m-K 1014(Ω.cm) 33 Shore A >48 Hours >48 Hours

ANNOTATION

All specifications shown herein are typical values and are not guaranteed.  It is recommended to test in application for suitability.

 

   

   Registered Company Number: 3832422 - VAT Number: GB740 7652 32
   AMEC Thermasol is a division of Marcom Electronic Components (UK) Ltd.
   Copyright 2016 Marcom Electronic Components (UK) Limited. - All rights reserved.
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   Address:   AMEC Thermasol, Marcom House, 1-2 Steam Mill Lane, Great Yarmouth, Norfolk, NR31 0HP, United Kingdom.

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